However, such dramatic improvements have resulted in lower yields due to manufacturability. Industry has demonstrated techniques to provide fault tolerance to the FPA, however, improvements can be achieved. As a direct result, this Phase II plans the integration of fault tolerance technologies into the readout integrated circuit (ROIC) of the FPA to overcome yield difficulties. Schematic designs of fault tolerant circuit technologies, simulations, and performance verification will be performed. Physical layouts of the verified circuits will be conducted and fabricated using a suitable foundry process, resulting in a ROIC hybridized with a mid-wave infrared detector array.
The technology developed under this SBIR would enable the development and fabrication of larger, more capable mid-wave infrared focal plane arrays with intrinsic fault tolerance to overcome manufacturing issues. It is anticipated that this technology would provide direct benefits to many DoD applications where improved FPAs are needed. In addition, fault tolerant ROIC technologies would also benefit commercial applications, including general surveillance, topographical surveying, identification, etc